Embedded Computing Design

RuggON Corporation introduced the VIKING II, a fleet management solution leveraging the Qualcomm Snapdragon 6490 Octa-Core Processor and utilizes Android 14 and Google Mobile Services (GMS).

GÖPEL electronic designed an innovative EMC chamber solution for automotive test applications. The EMC housing delivers the ability to push shielded measurements and tests when assessing a single control unit enabling extended data rates of the signals, and the supply lines, to the control unit keeping it as short as feasible. The enclosure’s absorber material is tailored to diminish constructive and destructive electromagnetic interference. Other shielding measures include galvanic isolation from the mains, mains filters, earthing options and shielded cables.

Developed on the Intel Arc A750E GPU architecture, AAEON's GAR-A750E delivers 28 Xe-Cores and supports various advanced AI development frameworks built in a 236mm x 109mm x 42mm form factor. The GAR-A750E features extensive raw computing power, with a graphics turbo frequency of 2400MHz combined with the AI task acceleration capabilities of the 448 Intel XMX Engines.

Wavre, Belgium and Los Altos, California. Exostiv Labs now supports AMD Versal Adaptive SoCs with its Exostiv and Exostiv Blade platforms, including the AMD Versal Premium VP1902. By extending compatibility from AMD 7 Series FPGAs and AMD UltraScale, UltraScale+, and Zynq adaptive SoCs, this update ensures it addresses the high-performance debugging needs of Versal users.

Rolling Wireless launched its first automotive-grade 5G Release 17 and NB-NTN Network Access Device (NAD). The RN941Y module delivers innovative connectivity to the next generation of vehicles in areas where terrestrial networks are unavailable. The 3GPP ecosystem’s full adoption of NTN enables devices, such as vehicles, to connect directly to satellites, delivering reliable connectivity in regions without normal access.

Irida Labs is joining the STMicroelectronics Partner Program and will deliver its vision AI solutions suites and its PerCV.ai that will be combined with ST’s STM32 microcontrollers (MCUs) and microprocessors for the seamless integration of scaled Vision AI applications.

Vecow Co., Ltd. introduced its ECX-4000 series, an innovative addition to its fanless embedded system portfolio. The solution leverages the Intel Core Ultra 200S Series Processors (Arrow Lake) and Intel W880 PCH making it suitable for AI-powered edge applications such as in-vehicle computing, intelligent logistics, smart city, public security, and more.

Austin, Texas. Ambiq released an innovation for over-the-counter (OTC) hearing aids integrating AI-powered speech enhancement technology utilizing the latest Apollo510 microcontroller (MCU). The solution addresses the long-standing challenges through advanced neural network real-time processing.

Taiwan. ASRock Industrial announced its newest range of industrial motherboards leveraging Intel Core Ultra 200S Processors (Arrow Lake-S) with Intel 800 series chipsets. The motherboards feature an advanced hybrid architecture with up to 24 cores and an upgraded NPU making them ideal for edge performance, energy-efficiency, and enhanced AI acceleration for complex AI driven workloads. Support for up to DDR5 6400 MHz memory, various I/O, expansion options, quad display capabilities, PCIe Gen5, and USB4/ Thunderbolt 4 for ultra-fast connectivity is delivered. Select models offer 10G LAN to meet the demands of high-speed networking.

RuggON Corporation introduces VORTEX, a vehicle mount computer tailored for tough industrial environments. The rugged system combines a 7-inch touch panel with the latest Intel Raptor Lake Core Processor for innovative power. VORTEX integrates advanced AI functions for real-time data processing and predictive analytics, along with SATCOM for seamless connectivity. Its rugged, fan-less construction withstands shocks and vibrations, ensuring durability in challenging environments.

AAEON introduced its NanoCOM-ADN, a COM Express Mini Size Type 10 module leveraging the Intel Atom x7000E and Intel Processor N-series CPUs, including the quad-core Intel Atom x7425E (12W) and 8 core Intel Core i3-N305 (15W).

Taipei, Taiwan. DFI will collaborate with DEEPX at CES 2025 to reveal industrial edge AI solutions integrated with the DX-M1 AI accelerator for smart city applications. The cooperation between the two shows promise innovating on-device and application-specific AI, leading to a more flexible, efficient, and sustainable edge AI implementation.

BlackBerry Limited released news that the division formerly known as BlackBerry IoT will be relaunched as QNX. “Relaunching the QNX brand is an important step in BlackBerry’s broader strategy to increase our visibility and fortify our leadership within the automotive and embedded industries, with a view to better positioning us for sustained growth and success,” said John J. Giamatteo, CEO at BlackBerry.

1NCE launched its Certified Integrators Program (CIP) that is aimed to empower external software developers to integrate seamlessly with 1NCE’s IoT platform. According to the press release, 1NCE equips integrators with tools to deliver streamlined, cost-effective IoT implementations for businesses across many verticals.

AAEON introduced its uCOM-IMX8P, an adaptable SMARC 2.1 compliant CPU module built on the NXP i.MX 8M Plus platform with an 82mm x 50mm SMARC form factor to utilize RISC architecture. The solution leverages the NXP i.MX 8M Plus’ Quad-Core Arm Cortex-A53 processor with an integrated NPU, an operating temperature range from -40°C ~ 85°C, and 4GB of onboard LPDDR4 memory and up to 128GB eMMC storage (default SKU: 16GB).

Knowles Corporation will reveal its innovative audio technologies at CES 2025 at the Venetian Resort, Toscana Suite #3801. Visit and learn more about the solutions benefiting hearing health, true wireless stereo (TWS), open wearable stereo (OWS), and audiophile applications. The exhibit will also include Knowles balanced armature (BA) drivers that have been integrated in the JLab Epic Sport ANC 3 and the Breggz ZOHN-1 custom earbuds.

sureCore recently announced a series of cryogenic IP in 180 nm and 22nm process nodes. It is collaborating with Sarcina, which developed a package that can withstand cryogenic temperatures. sureCore’s Static Random Access Memory (SRAM) has a temperature range from 77K (-196°C) down to near absolute zero that is essential for Quantum Computers (QCs).

IC’Alps and SEALSQ Corp. are collaborating further with the goal of innovating the expansion of custom quantum-resistant chips. IC’Alps’ ASIC design knowledge and SEALSQ’s security technology will combine to modernize production and look to evolve business opportunities.
 

CEA-Leti released it has achieved a milestone by integrating a scalable hafnia-zirconia ferroelectric capacitor platform into the back-end-of-line (BEOL) of the 22nm FD-SOI technology node making ferroelectric RAM (FeRAM) a formidable memory solution for cutting-edge nodes. Ferroelectricity in HfO2-based thin films are CMOS compatible and scalable while opening innovation for embedded FeRAM.

Taipei, Taiwan. IBASE Technology Inc. announced the IB996 Full-Size CPU Card leveraging the 14th, 13th, and 12th Gen Intel Core i9/i7/i5/i3 desktop processors. It follows the PICMG 1.3 standard and includes the Intel Q670E chipset for enhanced performance and flexibility. The IB996 supports up to 64GB of DDR5 memory with dual DIMM slots and enhanced networking ability with two Intel 2.5G LAN ports.